Die Verwendung von staubfreien Wattestäbchen im Chip-Herstellungsprozess

Zunächst, verstehen wir zunächst den Herstellungsprozess des Chips. Der Herstellungsprozess des Chips lässt sich grob in mehrere Schritte wie die Waferbearbeitung unterteilen, Wafer-Pin-Tests, Konstruktion, und testen. Unter ihnen, the wafer processing process and the wafer pin testing process are the front-end processes, and the assembly process and the test process are the back-end processes.
Jedoch, dust is easily generated during the chip packaging process. This dust is fatal to the chip, it can not only affect the quality of the chip, but also affect the life of the chip. In the process, if there is dust, use a clean cotton swab to clean it. The clean cotton swab can not only clean the dust, but also play an antistatic role.
For the entire chip manufacturing process, the assembly process is very important. It is to fix a single die on a plastic or ceramic chip base, and connect some lead terminals etched out of the die with the protruding pins at the bottom of the base to connect with external circuit boards. Endlich, cover the plastic cover and seal it with glue. The intention is to protect the die from mechanical scratches or high temperature damage. At this point, it is considered to be an integrated circuit chip (that is, the rectangular small blocks that are black or brown that we can see in the computer, with many pins or leads on both or four sides).
In the construction process, the dust must be wiped with a clean cotton swab. Because the chip is relatively small, it is not suitable for cleaning with other products such as wipes.