無塵棉籤在晶片製造過程中的使用

首先, 我們先了解晶片的製造流程. 晶片的製造過程大致可分為晶圓加工等幾個步驟, 晶圓引腳測試, 建造, 和測試. 他們之中, the wafer processing process and the wafer pin testing process are the front-end processes, and the assembly process and the test process are the back-end processes.
然而, dust is easily generated during the chip packaging process. This dust is fatal to the chip, it can not only affect the quality of the chip, but also affect the life of the chip. In the process, if there is dust, use a clean cotton swab to clean it. The clean cotton swab can not only clean the dust, but also play an antistatic role.
For the entire chip manufacturing process, the assembly process is very important. It is to fix a single die on a plastic or ceramic chip base, and connect some lead terminals etched out of the die with the protruding pins at the bottom of the base to connect with external circuit boards. 最後, cover the plastic cover and seal it with glue. The intention is to protect the die from mechanical scratches or high temperature damage. At this point, it is considered to be an integrated circuit chip (that is, the rectangular small blocks that are black or brown that we can see in the computer, with many pins or leads on both or four sides).
In the construction process, the dust must be wiped with a clean cotton swab. Because the chip is relatively small, it is not suitable for cleaning with other products such as wipes.